- Education
- Bachelor of Electrical and Electronics Engineering
- Bachelor of Mechatronics Engineering (Mainly Electronics)
- Experience wire bonder application engineer of field engineer have experience in wire bond process is prefer
- 2 years or more experience in equipment/process semiconductor manufacturing
- Have knowledge and able to operate Wire bonder machine
Other attributions
- Able to business trip domestic and overseas at customer factory
- If have experience in wire bond process will given special consideration
Welfare
1. Perfect Attendance Allowance
2. Uniform
3. Medical Expense
4. Group insurance
5. Food allowance
6. Provident fund
7. Company minibus
8. Bonus
Remark:
All usage applications and making documents in English
Contact :Ms.Watcharin/Ms.Thanika/Ms.Anchalee 02-529-6285-88
Can apply for a job at the company page