Maintenance Engineer

1.Supervising and Support Machine Maintenance at Dicing, Die Bonding and Wire Bonding.

2.Improvement of MTBF, MTTR and OEE.

3.Defects analysis and Improvement.

4.Spare part Control.

1. Male

2. Age 22 years old upward. 

3. Bachelor’s degree in Mechanical Engineering / Electronic Engineering.

4. Have Experience at least 5 Years about Maintenance job for Semiconductor Manufacturing.

5.Have knowledge about ICS packaging at Dicing, Die Bond and Wire Bonding Process.

6.Good Skill in machine repairing and defects analysis for Dicing, Die Bonding and Wire Bonding Machine.

• Provident Fund
• Staff training and development
• Overtime
• Fuel/transportation fees
• Marriage gift
• ค่ารักพยาบาล/ค่าทันตกรรม
• Ordination gift
• ค่าอาหาร
• Per diem
• 5-day work week
• Social security
• Accident Insurance
• Ordination leave
• สวัสดิการเงินเบิกล่วงหน้า (กรณีเหตุผลอันจำเป็น)
• Employee's uniform
• Funeral payment support
• เงินรางวัลพิเศษ
• Annual trip or party
• Performance/results-based bonus