Application Engineer
YAMAHA ROBOTICS MANUFACTURING ASIA CO., LTD15/11/2024
Full Time
2 - 5 Year
Pathumthani
Bachelor's Degree
Negotiable
- Improvement and confirm machine function by SEM, Oscilloscope, etc.
- Test bonding and evaluation to compare machine capability with competitor (Benchmark to check machine capability)
- Verify problem and improve the customer product parameter as customer requirement (Low ball shear test, non-sticking, no tail, etc.)
- Making technical report and propose to coordinate with concern department for support customer requirement
- Adjust and optimize the wire bonder machine to support the customer’s device to achieve bonding spec
- Setup and modify wire bonder machine by follow drawing from design
- Adjust and optimize bond parameter to support the product of each customer (support production department)
- Maesurement to confirm wire bonding quality (Ball size, BST, WPT, IMC, SEM, etc.)
- Education
- Bachelor of Electrical and Electronics Engineering
- Bachelor of Mechatronics Engineering (Mainly Electronics)
- Experience wire bonder application engineer of field engineer have experience in wire bond process is prefer
- 2 years or more experience in equipment/process semiconductor manufacturing
- Have knowledge and able to operate Wire bonder machine
Other attributions
- Able to business trip domestic and overseas at customer factory
- If have experience in wire bond process will given special consideration
Welfare
1. Perfect Attendance Allowance
2. Uniform
3. Medical Expense
4. Group insurance
5. Food allowance
6. Provident fund
7. Company minibus
8. Bonus
Remark:
All usage applications and making documents in English
Contact :Ms.Watcharin/Ms.Thanika/Ms.Anchalee 02-529-6285-88
Sent resumeto : yrh_th_hr_recruiter@yamaha-robotics.com
Can apply for a job at the company page
- Bonus
- Company minibus
- Food allowance
- Group insurance
- Medical Expense
- Perfect Attendance Allowance
- Uniform
- Provident Fund
YAMAHA ROBOTICS MANUFACTURING ASIA CO., LTDYAMAHA ROBOTICS MANUFACTURING ASIA CO., LTD commands the top global share as a manufacturer of bonders for the assembly process of semiconductor manufacturing (packaging). In a dramatically changing semiconductor industry, the company has met the expectations of the world's semiconductor manufacturers for more than fifty years as a reliable brand.
Location83/44 Moo 19 Nava Nakorn Industrial Zone Phaholyothin Rd., Klong Nueng, Klong Luang, Pathumthani 12120
Contact personMs.Watcharin/Ms.Thanika/Ms.Anchalee
Telephone0-2529-6285-88 Fax 0-2529-6289
Website
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